Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn-Ag alloy solders for flip-chip interconnections
Mi-Seok Park, Do-Hwan Nam*, Ki-Min Jung, Kyung-Sik Hong, Hyuk-Sang Kwon* (served as corresponding author)
RSC Adv., 2017, 7, 23136-23142.
Publication date: 2017.04.27.
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